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1st International Symposium H07 of Electronic, Thermal, and Electrochemical Properties of Metal Organic Frameworks (MOFs): Technology, Applications, and Emerging Devices

at the AiMES 2018 Fall Meeting of the Electrochemical Society (September 30 - October 4, 2018) in Cancun, Mexico.

1st International Symposium H07 of Electronic, Thermal, and Electrochemical Properties of Metal Organic Frameworks (MOFs): Technology, Applications, and Emerging Devices,
at the AiMES 2018 Fall Meeting of the Electrochemical Society (September 30 - October 4, 2018) in Cancun, Mexico.

Lead Organizer: Engelbert Redel
Co-organizers: Helmut Baumgart, Gunther Wittstock, Christof Wöll, Jinxuan Liu,
Hiroshi Kitagawa, Mark Allendorf
Sponsoring Divisions: Electronics and Photonics, Energy Technology, Organic and BiologicalElectrochemistry, Physical and Analytical Electrochemistry

During recent years research on electronic and electrochemical properties of Metal Organic Framework (MOF) based thin film materials and applications has created a new research field for specific functionalization of interfaces and surfaces. The work of various international research groups has contributed to discoveries of new physicochemical properties of MOFs with high application potentials. MOF synthesis and characterization have been supported by recent advances in theoretical models leading to better understanding of the fundamental materials science of MOFs. Today, highly porous and layered MOF materials have been successfully integrated into new technological applications ranging from microelectronics to sensors, batteries and photovoltaic devices as well as to functional thin film materials in the field of electrochemistry, optoelectronics, thermoelectrics, magnetism, data storage as well as to photo-/electrocatalysis chemical reactors and gas storage.

Call for Papers
The 1st International Symposium sponsored by the Electronics and Photonics Division of the Electrochemical Society brings together researchers in chemistry, materials science, physics, devices and process engineers and related interdisciplinary areas, to seek and capture the state-of-the art in MOF based fundamental aspects and latest technological applications. This symposium offers a new interdisciplinary and international platform, and aims to contribute towards advancing the fundamental understanding of the layered MOF thin films and aiming to improve technological applications thereof. Original contributions are solicited that cover all fundamental and applied aspects including electronic, thermal and electrochemical transport properties and phenomena, device/ system fabrication and integration of MOF thin films into emerging technological device applications. All oral presentations will be grouped into topical sessions. Invited Keynote speakers will present critical reviews covering recent advances and future directions in the diverse field of fundamental and applied MOF properties.

Invited Keynote Speakers:

M. Dincă
N. B. Shustova
P. Falcaro
A. A. Talin
R. Fischer
H. Kitagawa, University of Kyoto, Japan
A. Terfort
T. Bein
B. Chen
G. Xu
C. Wilmer
A. Shekha
J. Hupp
R. Banerjee

Please consider to present your work at this specialty MOF Symposium and join us at The AiMES 2018 ECS Fall Meeting. Our Symposium H07 will take place at the beautiful Moon Palace Resort in Cancun/Mexico: https://www.moonpalacecancun.com/en-us

You can find the full write-up for this symposium on the website of the Electrochemical Society, https://issuu.com/ecs1902/docs/2018-aimes-cfp-02?e=15319453/56987648

Abstract Submission

Abstracts for the symposium H07 should be submitted electronically to the ECS headquarter website and any questions and inquiries should be sent to the organizers. https://ecs.confex.com/ecs/aimes2018/cfp.cgi.

The deadline for abstract submission is Friday, March 16, 2018 at 11:59 PM Eastern Standard Time.

An enhanced edition of the ECS Transactions is planned to be available at the Meeting. All authors accepted for presentation are strongly encouraged to send their full text manuscript for the issue no later than June 29, 2018. All manuscripts will be submitted online and must be either in MS Word or PDF format.